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Key Features & Performance

Core Technologies
DDR5 SODIMM Memory Module
  • Superior Signal & Data Integrity: Supports Write CRC (Cyclic Redundancy Check) and Command/Address Parity to ensure error-free high-speed data transmission.
  • Ultra-Low Power Consumption: Core and I/O voltages at just 1.2V, paired with Maximum Power Saving mode and LPASR (Low Power Auto Self Refresh) to significantly reduce heat generation.
  • International Environmental Certifications: Fully compliant with RoHS lead-free and Halogen-Free standards, while strictly prohibiting 5PBT substances listed under TSCA.

Selection Guide

Product Specifications
Specification C-Die H-Die
Density & Organization
  • 2048Mb x4
  • 1024Mb x8
  • 512Mb x16
  • 2048Mb x4
  • 1024Mb x8
  • 512Mb x16
Max Data Rate 2666 Mbps / 3200 Mbps 2666 Mbps / 3200 Mbps
Supported Timings CL19-19-19 / CL22-22-22 CL19-19-19 / CL22-22-22
Package Dimensions
  • 78-Ball TFBGA (7.5 x 12.0 mm)
  • 96-Ball TFBGA (7.5 x 13.0 mm)
  • 78-Ball TFBGA (7.5 x 10.5 mm)
  • 96-Ball TFBGA (7.5 x 13.0 mm)
Key Advantages Mature, highly stable supply chain with exceptional cost-performance ratio. Optimized package size with superior data retention and refresh performance in high-temperature environments.

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